Infrastructure

Home Infrastructure

  • State of the art modern EMI/ EMC testing facility
  • Electronics & Instrumentation labs for design, test and measurement
  • PCB Design, fabrication and assembly
  • 3D Printing capability with 2.5 micron resolution up to the dimension of 215x215x300mm
  • Industrial grade scanning measuring accuracy of 0.03mm and resolution of 0.05mm
  • High precision LASER engraving, cutting and CNC milling
  • SMT assembly facility